Air Gap Formation for Microelectromechanical

Systems: PDM- 5034

Promerus’ PDM-5034 formation is designed to create air gaps on wafer-level substrates for microelectromechanical systems (MEMS).

FeaturesPDM-5034

  • Air gap formation
  • 1.00 dielectric constant
  • Thermally decomposable

Overview 

The packaging of microelectromechanical systems (MEMS) has proven to be costly and complex.

That’s why PDM-5034 was designed to produce air gaps on wafer level substrates, with a decomposition range from 150-400 degrees Celsius.

PDM-5034-2

 

So whether it’s to reap the benefits of a near perfect dielectric constant of air, or to set the stage for the encapsulation of a microelectromechanical (MEMS) device, PDM-5034 can aid your development.

 PDM-5034-3

 

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