Advanced Material Solutions | Promerus, LLC Blog

A Look Into Promerus' Top Materials for Electronic Appications

Feb 18, 2020 2:26:47 PM / by Brian Knapp

Untitled-1Promerus pioneered the catalyst technology that enabled addition polymerization of polynorbornenes (PNB). PNB is a class of cyclic olefin polymers (COP), which maintains the bicyclic ring structure in the backbone without the use of non-bicyclic comonomers. This allows the PNB backbone to remain rigid, resulting in glass transition temperatures (Tg) that are quite high, even >300 ̊C.

Unlike polyimides, which stiffen as they cure via ring-closing mechanism releasing volatile components at elevated cure temperatures, PNB does not require high cure temperatures in order to achieve a high Tg. Additionally, the ability to maintain high thermal characteristics with glass-like transparency is unique to the industry.

Furthermore, we can copolymerize a wide variety of norbornenes with functional groups (for adhesion, elongation, etc.) to tailor the PNB polymer to meet customer requirements. Through this unique ability to tailor PNB polymer compositions, we’re able to adjust the properties of our materials, while maintaining transparency across a broad spectrum of wavelengths.

For a look into our top materials, continue reading below.

1. PDM-5004

Need a solution to enhance the efficiency and longevity of light-emitting or organic light-emitting display (OLED) applications? 

Our proprietary blend (PDM-5004) can thermally cure to a high strength thermoset-like material for improved light extraction.

This formulation contains norbornene monomers that are coated directly on the substrate. During thermal cure, the monomers are polymerized in place, solidifying into a permanent material, with features of a thermoset, making PDM-5004 an ideal solution for electronic applications.

>>>Related Resource: View our LED & OLED light extraction materials.

2. PDM-5005

PDM-5005 is designed to be 100% reactive with no need for solvent. This one-part formulation is cured by brief exposure to UV light in the range of 365 and 405 nanometers (nm). A thermal cure is not required to obtain complete conversion.

The dielectric constant is quite low, typically 2.3. The viscosity is less than 30 cP for ink-jetting, but it can be tuned for other dispensing or coating techniques. Upon request, other properties may be tailored to meet customer needs.

>>>Related Resource: Uncover our solventless solution for coating applications.

3. PDM-5034

The packaging of microelectromechanical systems (MEMS) has proven to be costly and complex.

That’s why PDM-5034 was designed to produce air gaps on wafer level substrates, with a decomposition range from 150-400 ̊C.

So, whether it’s to reap the benefits of a near perfect dielectric constant of air, or to set the stage for the encapsulation of a MEMS device, PDM-5034 can aid your development.

>>>Related Resource: Learn more about our air gap formulation for MEMS systems.

4. PDM-5046

PDM-5046 can be used in a wide range of emerging applications in electronics and sensors.

While other optically transparent polymers are sensitive to temperatures of 150 – 200 ̊C, our COP are designed with a higher thermal stability and can operate at 200 - 300 ̊C.

The properties of these materials can also be tailored, including the modulus for stress compliance and the coefficient of thermal expansion (CTE).

The polymer is soluble in traditional solvents, like hexane and toluene, and is capable of being converted into film.

>>>Related Resource: Check out our cyclic olefin polymers for emerging applications in electronics.

5. PDM-5010

Need to deposit thin films? Our polymer solution can be specially formulated with additives and solvents for adhesion. Our solution viscosity can be tuned to meet the requirements of spin-coated film thicknesses of one to 10 microns. At that point, i-line photolithography can be used to create patterns and features on the wafer.

Once features are defined by developing them in TMAH, the wafer can be baked and diced for thermo-compressive bonding (heat and pressure).

After a no-outgassing low temperature (175 ̊C) cure, a high strength bond is created between substrates, which can endure wire-bonding or solder reflow temperatures (>4MPa at 260C).  

>>>Related Resource: Explore our spin-coatable polymers for thermocompression bonding.

Promerus is a technology-driven organization providing advanced material solutions for the next generation of application. These materials are based on high-purity COPs that provide outstanding electrical, mechanical, optical and thermal properties. For more information, download our Materials Guide to see what Promerus can do for you.

Topics: Semiconductor Materials

Brian Knapp

Written by Brian Knapp