Redistribution Layer: PDM-5013

Promerus’ PDM-5013 material is designed for redistribution layers in next generation technologies.

FeaturesPDM-5013

  • Photo-patternable with high resolution
  • TMAH or solvent developable
  • Low temperature cure
  • Low K dielectric 
  • Good thermal and mechanical properties
  • Good adhesion to metals
  • Good thermal cycling stability and solvent resistance 
  • Redistribution layers
  • Positive tone or negative tone

Overview

Redistribution is a process that utilizes photopatternable dielectrics to relocate electrically conductive traces.

In an industry moving toward smaller features and lower cure temperatures (170-200C), polynorbornenes are finding their advantage in today’s advanced packaging technologies. Polynorbornenes have an inherently high glass transition temperature (Tg) from their rigid polycyclic olefin backbone.

 

PDM-5013-2

 

Unlike its competition, PDM-5013 does not need a high cure temperature to increase the Tg. Instead its low cure temperature, balance of strength and elongation, make it an attractive candidate for next generation packaging technologies.

 

PDM-5013-5

 

Properties

Property Positive Tone Negative tone
Film Thickness 6 - 10 6 - 10
Dose (mJ/cm2) 350 - 600 400 - 700
Via Resolution (µm) 3 - 7 5 - 7
Cure Condition (ᵒC/hrs) 220/2 170/1
FT loss during cure (%) < 10 < 10
Taper Angle (deg) 60 - 65 90
ETB (%) 41 91
Tensile Strength (MPa) 90 161
Tg(ᵒC) 233 180 - 210
Td5 (ᵒC) > 300 270 - 280
CTE (ppm/K) 60 - 65 60 - 65

 

Promerus is a technology-driven organization providing advanced material solutions for the next generation of applications. These materials are based on high-purity cyclic olefin polymers that provide outstanding electrical, mechanical, optical and thermal properties. For more information, fill out the form below to explore our full list of materials and applications.

Download the full materials guide to uncover the appropriate materials for your application. 

This free guide to Promerus’ materials and applications is designed to help you better understand your options when it comes to polymer application requirements. Additionally, the guide will help you:

  • Identify your challenges in semiconductor, optoelectronic and electronic packing markets.
  • Discover the tunable properties of your application, including glass transition temperature, refractive index and more.
  • Uncover solutions to support your mission.

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